Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

ABSTRACT

In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.14/072,777, filed Nov. 5, 2013, which is a divisional of U.S. patentapplication Ser. No. 13/235,369, filed Sep. 17, 2011 which claims thebenefit of Korean Patent Application No. 10-2010-0119757 filed on Nov.29, 2010 in the Korean Intellectual Property Office, and all thebenefits accruing therefrom under 35 U.S.C. 119, the contents of whichin their entirety are herein incorporated by reference.

BACKGROUND

1. Technical Field

The present disclosure relates to a semiconductor device, a fabricatingmethod thereof, and a semiconductor package including the semiconductordevice.

2. Description of the Related Art

The manufacture of low-cost semiconductor products that are morereliable, light, compact, fast, multi-functional, and highly efficienthas long been an important goal for the electronic industry. One of thetechnologies that promises to achieve such a goal is a multi-chip stackpackage technology or system-in-package (SIP) technology employing athrough-silicon via (TSV).

The multi-chip stack package or SIP, multiple semiconductor devicesperforming different functions are assembled in a single semiconductorpackage body to save space for the electronic components. Although thethickness of the multi-chip stack package or SIP is greater than aconventional single chip package, its two-dimensional area can be aboutthe same as that of the conventional single chip package. Accordingly,the multi-chip stack package or SIP is mainly used for productsrequiring a high efficiency, a small size and portability, such asmobile phones, notebook computers, memory cards, or portable camcorders.

SUMMARY

In one embodiment, a semiconductor device comprises a semiconductorsubstrate having a first surface, and a second surface opposite to thefirst surface. The second surface defines a redistribution trench. Thesubstrate has a via hole extending therethrough. The semiconductordevice also includes a through via disposed in the via hole. The throughvia may include a via hole insulating layer, a barrier layer,sequentially formed on an inner wall of the via hole. The through viamay further include a conductive connector adjacent the barrier layer.The semiconductor device additionally includes an insulation layerpattern formed on the second surface of the substrate. The insulationlayer pattern defines an opening that exposes a region of a top surfaceof the through via. The semiconductor devices includes a redistributionlayer disposed in the trench and electrically connected to the throughvia. The insulation layer pattern overlaps a region of the conductiveconnector.

In another embodiment, a semiconductor device comprises a semiconductorsubstrate having a first surface and a second surface opposite to thefirst surface. The second surface defines a redistribution trench. Thesubstrate has a via hole extending therethrough. A through via isdisposed in the via hole and includes a via hole insulating layer and aconductive connector sequentially formed in the via hole. Thesemiconductor device further includes an insulation layer pattern formedon the second surface of the substrate. The insulation layer patterndefines an opening that exposes a region of a top surface of the throughvia. The semiconductor device additionally includes a redistributionlayer disposed in the redistribution trench and electrically connectedto the through via. The insulation layer pattern covers an interfaceregion between the second surface of the substrate and a top surface ofthe via hole insulating layer.

In still another embodiment, a method of fabricating a semiconductordevice includes forming a via hole in a semiconductor substrate; forminga via hole insulating layer within the via hole; forming a conductiveconductor layer within the via hole to form a through via extending froma first surface of the semiconductor substrate; thereafter, forming aredistribution trench in a substrate surface of the substrate oppositeto the first surface to define a second surface of the substrate, theredistribution trench connected with the via hole; forming an insulationlayer on the second surface including the trench; and removing a regionof the insulation layer to form an insulation layer pattern that definesan opening that exposes a region of the conductive conductor layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the inventive conceptwill become more apparent by describing in detail preferred embodimentsthereof with reference to the attached drawings in which:

FIG. 1 is a cross-sectional view illustrating a semiconductor deviceaccording to an embodiment of the inventive concept;

FIG. 2 is an enlarged view of a portion ‘a’ shown in FIG. 1;

FIG. 3 is a cross-sectional perspective view showing a through siliconvia (TSV) formed in the semiconductor device shown in FIG. 1;

FIGS. 4 and 5 are cross-sectional views illustrating a modification fromthe semiconductor device shown in FIG. 1;

FIG. 6 is a cross-sectional view illustrating a semiconductor deviceaccording to another embodiment of the inventive concept;

FIG. 7 is a cross-sectional view illustrating a modification from thesemiconductor device shown in FIG. 6;

FIG. 8 is a cross-sectional view illustrating a semiconductor deviceaccording to still another embodiment of the inventive concept;

FIG. 9 is a plan view illustrating a portion of the semiconductor deviceshown in FIG. 8;

FIGS. 10 to 14 are cross-sectional views illustrating a fabricatingmethod of a semiconductor device according to an embodiment of theinventive concept;

FIGS. 15 to 17 are cross-sectional views illustrating a fabricatingmethod of a semiconductor device according to another embodiment of theinventive concept;

FIGS. 18 to 21 are cross-sectional views illustrating a fabricatingmethod of a semiconductor device according to still another embodimentof the inventive concept;

FIG. 22 is a cross-sectional view illustrating an interposer to whichthe embodiment of the inventive concept shown in FIG. 6 is used;

FIG. 23 is a cross-sectional view illustrating a semiconductor packageusing the interposer shown in FIG. 22;

FIG. 24 is a cross-sectional view illustrating a semiconductor packageaccording to another embodiment of the inventive concept

FIGS. 25 and 26 illustrate a fabricating method of a semiconductorpackage, according to an embodiment of the inventive concept;

FIG. 27 is a schematic view of a memory card in which the semiconductordevice according to some embodiments of the inventive concept are used;

FIG. 28 is a schematic view of an electronic system in which thesemiconductor device according to an embodiment of the inventive conceptis used;

FIG. 29 is a schematic view of a mobile phone in which the electronicsystem according to an embodiment of the inventive concept is used;

FIG. 30 is a cross-sectional view illustrating a semiconductor deviceaccording to an embodiment of the inventive concept; and

FIG. 31 is a cross-sectional view illustrating of a semiconductor deviceaccording to another embodiment of the inventive concept;

DETAILED DESCRIPTION OF THE EMBODIMENTS

Advantages and features of the present disclosure and methods ofaccomplishing the same may be understood more readily by reference tothe following detailed description of preferred embodiments and theaccompanying drawings. The present disclosure may, however, be embodiedin many different forms and should not be construed as being limited tothe embodiments set forth herein. Rather, these embodiments are providedso that this disclosure will be thorough and complete and will fullyconvey the concept of the invention to those skilled in the art, and thepresent disclosure will only be defined by the appended claims. In thedrawings, the thickness of layers and regions are exaggerated forclarity.

Like numbers refer to like elements throughout. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “made of,” when used in this specification, specify the presenceof stated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another element. Thus, for example, a first element, afirst component or a first section discussed below could be termed asecond element, a second component or a second section without departingfrom the teachings of the present disclosure.

Embodiments described herein will be described referring to plan viewsand/or cross-sectional views by way of ideal schematic views of theinvention. Accordingly, the exemplary views may be modified depending onmanufacturing technologies and/or tolerances. Therefore, the embodimentsof the invention are not limited to those shown in the views, butinclude modifications in configuration formed on the basis ofmanufacturing processes. Therefore, regions exemplified in figures haveschematic properties and shapes of regions shown in figures exemplifyspecific shapes of regions of elements and not limit aspects of theinvention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

A semiconductor device according to an embodiment of the inventiveconcept will be described with reference to FIGS. 1 to 3. FIG. 1 is across-sectional view illustrating a semiconductor device according to anembodiment of the inventive concept, FIG. 2 is an enlarged view of aportion ‘a’ shown in FIG. 1, and FIG. 3 is a cross-sectional perspectiveview taken along a region where a through silicon via is formed in thesemiconductor device shown in FIG. 1.

Referring to FIG. 1, a semiconductor substrate 10 is provided. Forexample, the semiconductor substrate 10 may be a silicon substrate orother suitable semiconductor substrate such as a Ga—As substrate, a SiCsubstrate and so on. The semiconductor substrate 10 includes a firstsurface 11 and a second surface 12 opposite to the first surface 11. Forexample, the first surface 11 is an active surface on which anintegrated circuit 13 is disposed, and the second surface 12 is abackside surface opposite to the first surface 11.

The semiconductor device 1 may include the integrated circuit 13 formedon the first surface 11 of the semiconductor substrate 10. The type ofintegrated circuit 13 may vary according to the type of semiconductordevice 1. For example, the integrated circuit 13 may include a memorycircuit, e.g., a memory cell, a component of a logic circuit, or acombination thereof. Alternatively, the integrated circuit 13 may be apassive device including resistors or capacitors.

A via hole 16 spaced apart from the integrated circuit 13 is provided inthe semiconductor substrate 10. The via hole 16 may be formed to overlapa chip pad or bonding pad 71. Alternatively, the via hole 16 may beformed in a peripheral circuit area or a scribe lane area. The via hole16 may have substantially the same width or diameter from the firstsurface 11 to the second surface 12 of the semiconductor substrate 10 incross-sectional view. Alternatively, the via hole 16 may have differentwidths or diameters, or may be tapered from the first surface 11 to thesecond surface 12 of the semiconductor substrate 10.

A through electrode 20 is provided to fill at least a portion of the viahole 16. The through electrode 20 may be connected to the integratedcircuit 13 of the semiconductor device 1 or may be used to connect thesemiconductor device 1 to another semiconductor device, or to connectthe semiconductor device 1 to a package substrate or a module substrate.The through electrode 20 may include a barrier layer 24 formed on theinner wall of the via hole 16, and a conductive connector 26 formed onthe barrier layer 24.

The conductive connector 26 may fill at least a portion of the via hole16. A top surface 28 of the conductive connector 26 may be exposedthrough the second surface 12 of the semiconductor substrate 10, and mayhave substantially the same height as an adjacent region of the secondsurface 12 of the semiconductor substrate 10. Alternatively, a height ofthe top surface 28 of the conductive connector 26 may be lower than aheight of an adjacent region of the second surface 12 of thesemiconductor substrate 10 depending on the application.

A via hole insulating layer 22 may be provided between the semiconductorsubstrate 10 (exposed by the via hole 16) and the barrier layer 24. Forexample, the via hole insulating layer 22 may include a silicon oxidelayer (SiO_(x)), a silicon nitride layer (Si_(x)N_(y)), or a siliconoxynitride layer (SiO_(x)N_(y)). The barrier layer 24 may be made of amaterial capable of preventing a conductive material forming theconductive connector 26 from being diffused into the semiconductorsubstrate 10. For example, the barrier layer 24 may include titanium(Ti), tantalum (Ta), titanium nitride (TiN) or tantalum nitride (TaN).The conductive connector 26 may include copper (Cu), tungsten (W),aluminum (Al), silver (Ag), gold (Au), indium (In) or polysilicon. Thevia hole insulating layer 22, the barrier layer 24, and the conductiveconnector 26 may be collectively referred to as a through via 23.

In some embodiments, top surfaces of the barrier layer 24 and the viahole insulating layer 22 are positioned at substantially the same heightas a neighboring region of the second surface 12 of the substrate 10.

In another embodiment, the top surface 91 of the via hole insulatinglayer 22 may be substantially coplanar with a bottommost portion of thesecond surface 12.

A redistribution trench 103 may be formed on the second surface 12 ofthe semiconductor substrate 10. In other words, the second surface 12may define the redistribution trench 103. A redistribution layer 45 maybe provided to fill at least a portion of the trench 103 and to beelectrically connected to the through via 23. That is to say, theredistribution layer 45 may be formed by a damascene process. A topsurface 46 of the redistribution layer 45 may be positioned atsubstantially the same height as or lower than a topmost surface of aninsulation layer pattern 35. In other words, a top surface 77 of theinsulation layer pattern 45 may be substantially coplanar with the topsurface 46 of the redistribution layer 45.

The redistribution layer 45 is buried in the trench 103 formed in thesecond surface 12 of the semiconductor substrate 10, thereby planarizingthe semiconductor device 1 having the redistribution layer 45, andlowering the height of the semiconductor device 1. The redistributionlayer 45 may be formed by a plating process and may be made of the sameconductive materials as the conductive connector 26.

Also, the through via 23 may be disposed below the redistribution layer45 as shown in FIG. 1, for example. In addition, the top surface 28 ofthe conductive connector of the through via 23 may be contiguous with abottommost surface of the redistribution layer 45.

Referring to FIG. 3, the redistribution layer 45 is electricallyconnected to the through electrode 20. In one embodiment, theredistribution layer 45 may directly contact the region of theconductive connector 26 of the through via 23 exposed through an opening33 (FIG. 2) of the insulation layer pattern 35.

In addition, even when a connection terminal 83 of an additionalsemiconductor device (not illustrated) connected to the semiconductordevice 1 is not formed corresponding to, i.e., directly overlying, thelocation of the through electrode 20, the redistribution layer 45 maystill allow the connection terminal 83 to be electrically coupled to thethrough electrode 20 therethrough. The additional semiconductor devicemay be connected to the semiconductor device 1 using the redistributionlayer 45 and the connection terminal 83.

An insulation layer pattern 35 may be provided between a region of thesecond surface 12 of the semiconductor substrate 10 defining the trench103 and the redistribution layer 45. The insulation layer pattern 35 maybe formed on a portion of an inner wall of the trench 103.

In some embodiments, the insulation layer pattern 35 may directlycontact the second surface 12 of the substrate 10, and theredistribution layer 45 may be formed on the insulation layer pattern35.

In some embodiments, the insulation layer pattern 35 may include asilicon oxide layer, a silicon nitride layer, or a silicon oxynitridelayer, or combinations thereof. The insulation layer pattern 35 may beconformally formed along the second surface 12 of the semiconductorsubstrate 10 and exposes a predetermined region of the top surface 28 ofthe conductive connector 26 of the through via 23. Specifically, theinsulation layer pattern 35 defines an opening 33 (FIG. 2) that exposesa region of the top surface 28 of the conductive connector 26 of thethrough via 23 according to an embodiment the inventive concept.

A width w2 of the predetermined region of the top surface 28 of theconductive connector 26 or the through via 23 exposed through theinsulation layer pattern 35 may be smaller than a width w1 of the viahole 16 or a width w3 of the conductive connector 26. Also, the width w2of the opening 33 may be smaller than the width w3 of the conductiveconnector 26.

Therefore, the opening 33 of the insulation layer pattern 35 may bedisposed above an area defined by the top surface 28 of the conductiveconnector 26. The insulation layer pattern 35 may cover a portion, e.g.,an edge portion, of the top surface of the through via 23 exposedthrough the second surface 12 of the semiconductor substrate 10. Aportion of the insulation layer pattern 35 may overlap a predeterminedregion of the through via 23, for example, a predetermined region of theconductive connector 26.

In some embodiments, a bottom surface of the insulation layer pattern 35is contiguous with a top surface 91 of the via hole insulating layer 22.

In some embodiments, the insulation layer pattern 35 may cover aninterface region between the second surface 12 of the substrate 10 andthe top surface 91 of the via hole insulating layer 22 as explainedfurther below.

Referring to FIG. 2, a sidewall 36 of the insulation layer pattern 35overlying the through via 23 may be spaced apart from an inner wall 17of the via hole 16 and may be positioned on the conductive connector 26.The width w2 of the predetermined region of the top surface 28 of theconductive connector 26 of the through via 23 exposed through theinsulation layer pattern 35 may be smaller than the width 23 of theconductive connector 26.

If the insulation layer 35′ is patterned such that a sidewall 36 of theinsulation layer pattern 35 is located on the conductive connector 26,the via hole insulating layer 22 and the barrier layer 24 are notexposed during the formation of the insulation layer pattern 35. Thus,it is possible to help prevent the via hole insulating layer 22 and thebarrier layer 24 from being damaged. It is therefore also possible tohelp prevent a material forming the conductive connector 26 from beingpermeated into the substrate 10, which could result from damage to thevia hole insulating layer 22 and the barrier layer 24. Accordingly, itis possible to help prevent characteristics of the semiconductor device1 from being degraded. In addition, when a portion of the insulationlayer 35′ on the through via 23 is removed, the via hole insulatinglayer 22 can be protected from damage. Thus, in the subsequent processof forming the redistribution layer 45 in the trench 103, it is possibleto block the material forming the redistribution layer 45 from beingpermeated into a region from which the via hole insulating layer 22 isremoved. Therefore, the substrate 10 and the through electrode 20 can beprevented from being shorted. The integrated circuit 13 may beelectrically connected to the chip pad 71 and the through electrode 20through an internal wiring layer 50. The internal wiring layer 50includes a wiring pattern 52 and contact plugs 51 and 53. The throughelectrode 20 may also be electrically connected to the chip pad 71 orthe integrated circuit 13 through the internal wiring layer 50. Thenumbers and locations of the wiring pattern 52 and the contact plugs 51and 53 may vary according to locations of the integrated circuit 13, thethrough via 23, and the chip pad 71.

In one embodiment, a second insulating layer 60 covering the internalwiring layer 50 may be provided. For example, the second insulatinglayer 60 may be a passivation layer for protecting an interlayerdielectric layer (not illustrated) or the integrated circuit 13. Theinternal wiring layer 50 may be formed under or within the secondinsulating layer 60. In addition, the internal wiring layer 50 may beformed such that it is buried in a through hole formed in the secondinsulating layer 60. The second insulating layer 60 may include a firstsub-insulating layer 61 and a second sub-insulating layer 62sequentially formed on the first surface 11 of the semiconductorsubstrate 10. The through via 23 may be in the form of a via middlepenetrating through a portion of the second insulating layer 60, forexample, the first sub insulating layer 61. The through via 23 may beformed during formation of the integrated circuit 13 and the internalwiring layer 50. However, the through via 23 may be formed as a via lastdepending on the application.

A third insulating layer 72 exposing the chip pad 71 may be formed onthe second insulating layer 60.

In one embodiment, a protective layer 63 formed of a dielectric materialmay be formed over the semiconductor substrate 10 including theredistribution layer 45. The protective layer 63 may have an openingpart 89 (FIG. 24) exposing a portion of the redistribution layer 45 suchthat the connection terminal 83 can be mounted thereon. As a result, theconnection terminal 83 can be electrically coupled to the redistributionlayer 45 and to the through via 23.

A first connection terminal 73 for a connection with an externalapparatus may be provided on the first surface 11 of the semiconductorsubstrate 10. The first connection terminal 73 may be at least oneselected from the group consisting of a conductive bump, a solder ball,a conductive spacer, a pin grid array (PGA), and combinations thereof.The first connection terminal 73 may connected to the chip pad 71.

Another embodiment, which is a modification from the semiconductordevice shown in FIG. 1, will now be described with reference to FIGS. 4and 5. Here, substantially the same elements as those of FIG. 1 aredenoted by identical reference numerals, and detailed descriptionsthereof will be omitted.

Referring to FIG. 4, a sidewall 36 of an insulation layer pattern 35 maybe positioned on a via hole insulating layer 22. For example, thesidewall 36 of the insulation layer pattern 35 may be positioned on thetop surface 91 of the via hole insulating layer 22. If the insulationlayer pattern 35 is formed to cover an interface region between the viahole insulating layer 22 and a semiconductor substrate 10 withoutexposing the entire top surface of the through via 23. In other words,when the top surface of the through via 23 is exposed through a secondsurface 12 of the semiconductor substrate 10 during removal of theinsulation layer 35′ on the through via 23 to form the insulation layerpattern 35, the via hole insulating layer 22 may not be removed at theinterface between the semiconductor substrate 10 and the via holeinsulating layer 22, thereby protecting the semiconductor substrate 10and the through electrode 20 from being shorted.

Referring to FIG. 5, at least a portion of a top surface 28 of aconductive connector 26 exposed through the insulation layer pattern 35may be lower than top surfaces of the via hole insulating layer 22 andthe barrier layer 24. When a trench 103 is formed in the initial surface12′ of the semiconductor substrate 10, the barrier layer 24 on the topsurface 28 of the conductive connector 26 is removed and the top surface28 of the conductive connector 26 may also be slightly removed.

A semiconductor device according to another embodiment of the inventiveconcept will now be described with reference to FIG. 6. FIG. 6 is across-sectional view illustrating a semiconductor device according toanother embodiment of the inventive concept. Here, substantially thesame elements as those of FIG. 1 are denoted by identical referencenumerals, and detailed descriptions thereof will be omitted.

Referring to FIG. 6, a through via 23 of a semiconductor device 2 mayinclude an elevated portion 27 of a conductive connector 26 that extendsabove the level of the neighboring region of a second surface 12 of asemiconductor substrate 10. That is to say, a top surface of aconductive connector 26 is higher than the second surface 12 of thesemiconductor substrate 10 in the neighboring region, for example, thebottommost part of the second surface 12 of the semiconductor substrate10.

According to an embodiment of the present disclosure, a top surface 28of the elevated portion 27 of the conductive connector 26 may bedisposed below a top surface 46 of the redistribution layer 45.

In some embodiments, an extended part 21 of the via hole insulatinglayer 22 extends above a bottommost portion of the second surface 12.The insulation layer pattern 35 may cover a sidewall 79 of the extendedpart 21 of the via hole insulating layer 22.

The insulation layer pattern 35 formed on the sidewall 79 of theelevated part 23 of the via hole insulating layer 22 of the through via23 may also be formed on a predetermined region of a top surface 28 ofthe elevated portion 27 of the conductive connector 26 exposed throughthe second surface 12 of the semiconductor substrate 10. A sidewall 36of the insulation layer pattern 35 is spaced apart from an inner wall 17of a via hole 16 and may be positioned on the through via 23. Forexample, the sidewall 36 of the insulation layer pattern 35 may bepositioned on the top surface 28 of the conductive connector 26. In thesemiconductor device 2, the elevated portion 27 of the conductiveconnector 26 may be used as a portion of the redistribution layer 45.Here, if the conductive connector 26 and the redistribution layer 45 aremade of the same metal, the metal forming the conductive connector 26 isthermally processed in the course of manufacturing the semiconductordevice 2. Accordingly, resistance of the metal forming the conductiveconnector 26 may be smaller than that of the metal forming theredistribution layer 45. Therefore, if the through via 23 protrudes fromthe second surface 12 of the semiconductor substrate 10, theredistribution layer 45 having relatively small resistance can beimplemented. Alternatively, the redistribution layer 45 may be formed ofa material that is different from the material that forms the conductiveconnector 26.

In addition, if the through via 23 is formed to have the elevatedportion 27, since the top surface 28 of the conductive connector 26protrudes above the second surface 12 of the semiconductor substrate 10,an etching process margin can be increased during etching for removing aportion of an insulation layer to form the insulation layer pattern 35on the through via 23.

In some embodiments, the insulation layer pattern 35 may form a ridge 29rising above a level of the second surface 12 of the semiconductorsubstrate 10 and extends over the via hole insulating layer 22 and thebarrier layer 24.

A modification example of the semiconductor device shown in FIG. 6 willnow be described with reference to FIG. 7. FIG. 7 is a cross-sectionalview illustrating a modification example of the semiconductor deviceshown in FIG. 6. Here, substantially the same elements as those of FIG.6 are denoted by identical reference numerals, and detailed descriptionsthereof will be omitted.

Referring to FIG. 7, a through via 23 may be tapered such that its widthgradually increases from the first surface 11 to the second surface 12of the semiconductor substrate 10. If the through via 23 has arelatively greater width on the second surface 12, contact resistancebetween the through via 23 and a redistribution layer 45 can be reduced.However, the through via 23 has a smaller width at the first surface 11of the semiconductor substrate 10 than at the second surface 12 of thesemiconductor substrate 10, thereby preventing an area of an activeregion from being decreased.

In some embodiments, the through via 23 may be step-wise tapered incross-sectional view as shown in FIG. 30.

In another embodiment, the through via 23 may have a step 39 incross-sectional view as shown in FIG. 31. With these embodiments of thepresent disclosure, contact resistance can be reduced because thecontact area between the redistribution layer 45 and the conductiveconnector 26 can be increased with these embodiments. One skilled in theart will appreciate how to form such structures. For example, aninterconnection trench 109 can be formed in the upper part of the viahole 16 to form the step 39, after the via hole 16 is formed.Alternatively, the via hole 16 may be formed after the interconnectiontrench 109 is formed. The width w7 of the interconnection trench may begreater than the width w1 of the via hole 16. In addition, additionalinterconnection trench 111 can be optionally formed in the lower part ofthe via hole 16 as shown.

While FIG. 7 illustrates a modified example of FIG. 6 in which thethrough via 23 is tapered, the tapered through via 23 may also beapplied to other semiconductor devices described in the specification ofthe inventive concept.

A semiconductor device according to still another embodiment of theinventive concept will now be described with reference to FIGS. 8 and 9.FIG. 8 is a cross-sectional view illustrating a semiconductor deviceaccording to still another embodiment of the inventive concept, and FIG.9 is a plan view illustrating a portion of the semiconductor deviceshown in FIG. 8. FIG. 8 is a cross-sectional view taken along line I-I′of FIG. 9. Here, substantially the same elements as those of FIG. 1 aredenoted by identical reference numerals, and detailed descriptionsthereof will be omitted.

Referring to FIGS. 8 and 9, a width w4 of a trench 105 formed over athrough via 23 and exposing the through via 23 may be smaller than awidth w1 of a via hole 16. As a result, a portion of a top surface 92(FIG. 2) of a via hole insulating layer 22 may not be exposed through asecond surface 12 of a semiconductor substrate 10. That is, aninsulation layer pattern 35 may be positioned on the inner wall of thetrench 105 and not on a top surface 28 of the through via 23.Alternatively, the insulation layer pattern 35 may be positioned toextend to a portion of the top surface 28 of the through via 23. Forexample, a sidewall 36 of the insulation layer pattern 35 may bepositioned on a conductive connector 26.

In some embodiments, the insulation layer pattern 35 may extendvertically along a portion of the via hole insulating layer 22. Also,the insulation layer pattern may cover a top surface of the barrierlayer 24.

A redistribution layer 45 may include a first sub redistribution layer47 overlapping with the through via 23 and a second sub redistributionlayer 48 not overlapping with the through via 23. Here, the first subredistribution layer 47 and the second sub redistribution layer 48 mayhave different thicknesses. In an exemplary embodiment, a thickness d2of the second sub redistribution layer 48 may be greater than athickness d1 of the first sub redistribution layer 47.

In some embodiments, a width of the first sub redistribution layer 47may be smaller that the width w1 of the via hole 16.

A fabricating method of a semiconductor device according to anembodiment of the inventive concept will now be described with referenceto FIGS. 10 to 14 together with FIG. 1. FIGS. 10 to 14 arecross-sectional views illustrating a fabricating method of asemiconductor device according to an embodiment of the inventiveconcept. For the sake of convenience of explanation, a portion to FIGS.10 to 14 together with FIG. 1. FIGS. Here, substantially the sameelements as those of FIG. 1 are denoted by identical reference numerals,and detailed descriptions thereof will be omitted.

Referring to FIG. 10, a through electrode 20 filling a via hole 16extending from a first surface 11 to an initial second surface or asubstrate surface 12′ of a semiconductor substrate 10 may be formed. Theinitial second surface 12′ is opposite to the first surface 11. Thethrough electrode 20 may not be exposed to the initial second surface12′. A via hole insulating layer 22 may be formed between thesemiconductor substrate 10 exposed by the via hole 16 and the throughelectrode 20. The formation of the through electrode 20 may includesequentially forming a barrier layer 24 and a conductive connector 26 onthe via hole insulating layer 22. The via hole 16 and the throughelectrode 20 may be formed during the formation of an integrated circuit13 and an internal wiring layer (50 of FIG. 1) on the semiconductorsubstrate 10. For example, a via hole 16 is formed in a semiconductorsubstrate 10. A via hole insulating layer 22 may be formed within thevia hole 16. A conductive conductor layer is formed within the via hole16 to form the conductive connector 26 extending from a first surface 11of the semiconductor substrate 10. Then, although not shown, aplanarization process is performed over the resulting structureincluding the conductive conductor layer to form the through via 23.

The conductive connector 26 may include copper (Cu), tungsten (W),aluminum (Al), silver (Ag), gold (Au), indium (In) or polysilicon. Theconductive connector 26 made of copper (Cu) may be formed by plating.The plating may include forming a seed layer (not shown) on the barrierlayer 24. The conductive connector 26 made of tungsten (W), aluminum(Al) or polysilicon may be formed using a physical vapor deposition(PVD) layer or a chemical vapor deposition (CVD) layer.

In one embodiment, a surface of the substrate 10 opposite to the firstsurface 11 may be grinded or planarized before forming a redistributiontrench 103 (FIG. 11) to form the initial second surface or substratesurface 12′.

A first photoresist pattern 101 may be formed on the initial secondsurface 12′ of the semiconductor substrate 10. The first photoresistpattern 101 may be formed where the redistribution layer (45 of FIG. 1)is not to be formed.

Referring to FIG. 11, the redistribution trench 103 may be formed in theinitial second surface 12′ of the semiconductor substrate 10 by removinga predetermined region of the semiconductor substrate 10 exposed throughthe first photoresist pattern 101 using the first photoresist pattern101 as an etch mask. The etching may include dry etching. The etchingmay be performed to form the redistribution trench 103, thereby defininga second surface 12 of the substrate 10 until a top surface of theconductive connector 26 is exposed. The redistribution trench 103 may beconnected with the via hole 16. The second surface 12 of thesemiconductor substrate 10 in the trench 103 may have substantially thesame height as the exposed surface of the conductive connector 26.Alternatively, the exposed surface of the conductive connector 26 may belower than the second surface 12 of the semiconductor substrate 10 inthe trench 103. After the etching, the first photoresist pattern 101 maybe removed.

Referring to FIG. 12, an insulation layer 35′ may be formed on thesecond surface 12 of the semiconductor substrate 10 having the trench103. The insulation layer 35′ may be formed by, for example, physicalvapor deposition (PVD) or chemical vapor deposition (CVD). Theinsulation layer 35′ may be formed on the second surface 12 of thesemiconductor substrate 10. In some embodiments, the insulation layer35′ may be conformally formed on the second surface 12 of thesemiconductor substrate 10. A second photoresist pattern 110 may beformed on the insulation layer 35′. The second photoresist pattern 110may be formed at a location of a region from which the insulation layer35′ is not to be removed. A predetermined region 35 a of the insulationlayer 35′ exposed through the second photoresist pattern 110 may beremoved to form an opening 33 shown in FIG. 13. The second photoresistpattern 110 may be formed such that a width w5 of the predeterminedregion 35 a of the insulation layer 35′ is smaller than a width w1 ofthe via hole 16 or a width w3 of the conductive connector 26.

Referring to FIG. 13, the predetermined region 35 a of the insulationlayer 35′ exposed through the second photoresist pattern 110 is etchedusing the second photoresist pattern 110 as an etch mask to form aninsulation layer pattern 35.

In one embodiment, the insulation layer pattern 35 may be formed whileleaving a portion of the insulating layer 35′ covering an interfaceregion between the second surface 12 of the substrate 10 and a topsurface of the via hole insulating layer 22.

In some embodiments, the etching may include wet etching or dry etching.As a result, the insulation layer pattern 35 defines the opening 33 thatexposes a region of the top surface 28 of the through via 23.

A width w2 of a predetermined region of the top surface 28 of theconductive conductor 26 of the through via 23 exposed by the firstinsulation layer pattern 35 may be smaller than the width w1 of the viahole 16 or the width 23 of the conductive connector 26. The firstinsulation layer pattern 35 may cover a portion, e.g., an edge portion,of the top surface of the through via 23 exposed through the secondsurface 12 of the semiconductor substrate 10. That is to say, a portionof the first insulation layer pattern 35 may overlap a portion of thethrough via 23, e.g., the predetermined region of the conductiveconnector 26. A sidewall 36 of the first insulation layer pattern 35 maybe spaced apart from an inner wall 17 of the via hole 16 and may bepositioned on the conductive connector 26.

If the sidewall 36 of the first insulation layer pattern 35 is formed tobe positioned on the conductive connector 26, the via hole insulatinglayer 22 and the barrier layer 24 are not exposed while removing aportion of the insulation layer 35′ to form the insulation layer pattern35 on the through via 23. Thus, it is possible to protect the via holeinsulating layer 22 and the barrier layer 24 from being damaged.

As the result, it is also possible to prevent a material forming theconductive connector 26 from being permeated into the substrate 10,which could result from damage to the via hole insulating layer 22 andthe barrier layer 24. Accordingly, it is possible to preventcharacteristics of the semiconductor device 1 from being degraded. Inaddition, when the insulation layer pattern 35 on the through via 23 isremoved, the via hole insulating layer 22 can be prevented from beingdamaged. Thus, in the subsequent process of forming the redistributionlayer 45 in the trench 103, it is possible to prevent a material formingthe redistribution layer 45 from being permeated into a region fromwhich the via hole insulating layer 22 is removed. Therefore, thesubstrate 10 and the through electrode 20 can be prevented from beingshorted. The integrated circuit 13 may be electrically connected to thechip pad 71 and the through electrode 20 through an internal wiringlayer 50.

Referring to FIG. 14, a conductive layer 40 for forming a redistributionlayer 45 (FIG. 1, for example) may be formed on the insulation layerpattern 35. If the redistribution layer forming conductive layer 40 ismade of copper (Cu), it may be formed by plating. The plating mayinclude forming a seed layer (not shown) on the insulation layer pattern35. In a case where the redistribution layer forming conductive layer 40is made of tungsten (W), aluminum (Al) or polysilicon, it may be formedusing a physical vapor deposition (PVD) layer or a chemical vapordeposition (CVD) layer.

The resulting structure may be planarized using a planarization processto form the redistribution layer 45 shown in FIG. 1 until a top surfaceof the insulation layer pattern 35 on the initial second surface 12′ ofthe semiconductor substrate 10 is exposed. As a result, the top surface77 of the insulation layer pattern 35 may be substantially coplanar witha top surface 46 of the redistribution layer 45 according to anembodiment of the inventive concept. For example, the planarizingprocess may be a chemical mechanical polishing (CMP) process of removingthe conductive layer 40. In the planarizing process, the insulationlayer pattern 35 formed on the initial second surface 12′ of thesemiconductor substrate 10 may be used as a planarizing stopper layer.That is, the redistribution layer 45 may be formed by a damasceneprocess. The top surface 46 of the redistribution layer 45 may bepositioned at substantially the same height with as discussed or lowerthan the uppermost surface of the insulation layer pattern 35. As aresult, the redistribution layer 45 is buried in the trench 103 formedin the second surface 12 of the semiconductor substrate 10, therebylowering the height of the semiconductor device 1.

A fabricating method of a semiconductor device according to anotherembodiment of the inventive concept will now be described with referenceto FIGS. 15 to 17 together with FIG. 6. FIGS. 15 to 17 arecross-sectional views illustrating a fabricating method of asemiconductor device according to another embodiment of the inventiveconcept. For convenience of explanation, a portion ‘B’ shown in FIG. 6is exaggerated in FIGS. 15 to 17. Here, substantially the same elementsas those of FIG. 6 are denoted by identical reference numerals, anddetailed descriptions thereof will be omitted. The following descriptionwill focus on processes different from those shown in FIGS. 10 to 14.

Referring to FIG. 15, a through via 23 is formed in a semiconductorsubstrate 10 in the same manner as shown in FIG. 10, a first photoresistpattern 101 is formed on the initial second surface 12′ of thesemiconductor substrate 10. Next, a predetermined region of thesemiconductor substrate 10 exposed by the first photoresist pattern 101is removed using the first photoresist pattern 101 as an etch mask inthe same manner as shown in FIG. 11, thereby forming a redistributiontrench 104. Here, in order to secure an open margin enough to expose onesurface, that is, a top surface 28, of the conductive connector 26, thepredetermined region of the semiconductor substrate 10 may beover-etched. As the result, the through via 23 may have an elevatedportion (27 of FIG. 6) rising from a second surface 12 of asemiconductor substrate 10.

Referring to FIG. 16, an insulation layer 35′ may be formed on thesecond surface 12 of the semiconductor substrate 10 having the trench104. The insulation layer 35′ may be formed by physical vapor deposition(PVD) or chemical vapor deposition (CVD). The insulation layer 35′ maybe conformally formed along the second surface 12 of the semiconductorsubstrate 10. A second photoresist pattern 110 may be formed on theinsulation layer 35′. The second photoresist pattern 110 may be formedwhere the insulation layer 35′ is not to be removed. A predeterminedregion 35 a of the insulation layer 35′ exposed by the secondphotoresist pattern 110 may be removed. The second photoresist pattern110 may be formed such that a width w5 of the predetermined region 35 aof the insulation layer 35′ is smaller than a width w1 of the via hole16 or a width w3 of the conductive connector 26.

Referring to FIG. 17, the predetermined region 35 a of the insulationlayer 35′ exposed by the second photoresist pattern 110 is etched usingthe second photoresist pattern 110 as an etch mask to form an insulationlayer pattern 35 that has an opening 33. The etching may include wetetching or dry etching. A width w2 of a predetermined region of onesurface of the through via 23 exposed by the insulation layer pattern 35or the opening 33 may be smaller than the width w1 of the via hole 16 orthe width 3 of the conductive connector 26. The insulation layer pattern35 may cover sidewalls of the elevated portion (27 of FIG. 6) of thethrough via 23 exposed through the second surface 12 of thesemiconductor substrate 10 and a portion of a top surface of theelevated portion 27. That is, a portion of the insulation layer pattern35 may overlap the predetermined region of the through via 23, e.g., thepredetermined region of the conductive connector 26. A sidewall 36 ofthe insulation layer pattern 35 may be spaced apart from an inner wall17 of the via hole 16 and may be positioned on the conductive connector26.

The conductive layer 40 for forming a redistribution layer 45 as shownin FIG. 6 may be formed on the insulation layer pattern 35 in the samemanner as shown in FIG. 14, and the insulation layer pattern 35 formedon the initial second surface 12′ of the semiconductor substrate 10 maybe exposed by a planarizing process. For example, the planarizingprocess may be a chemical mechanical polishing (CMP) process of removingthe redistribution layer forming conductive layer 40. In the planarizingprocess, the insulation layer pattern 35 formed on the initial secondsurface 12′ of the semiconductor substrate 10 may be used as aplanarizing stopper layer.

A fabricating method of a semiconductor device according to stillanother embodiment of the inventive concept will now be described withreference to FIGS. 18 to 21 together with FIG. 8. FIGS. 18 to 21 arecross-sectional views illustrating a fabricating method of asemiconductor device according to still another embodiment of theinventive concept. For convenience of explanation, a portion ‘C’ shownin FIG. 8 is exaggerated in FIGS. 18 to 21. Here, substantially the sameelements as those of FIG. 8 are denoted by identical reference numerals,and detailed descriptions thereof will be omitted. The followingdescription will focus on processes different from those shown in FIGS.10 to 14.

Referring to FIG. 18, a through via 23 is formed in a semiconductorsubstrate 10 in the same manner as shown in FIG. 10, a third photoresistpattern 121 is formed on the initial second surface (may also bereferred to as a substrate surface) 12′ of the semiconductor substrate10. The third photoresist pattern 121 may be formed where aredistribution layer (47 and 48 of FIG. 7) is not formed. A width w6 ofa region of the through via 23 exposed by the third photoresist pattern121 may be smaller than the width w1 of the via hole 16.

Referring to FIG. 19, trenches 105 and 106 may be formed in the initialsecond surface 12′ of the semiconductor substrate 10 by removing apredetermined region of the semiconductor substrate 10 exposed by thethird photoresist pattern 121 using the third photoresist pattern 121 asan etch mask. The etching may be performed on a region where the throughvia 23 is formed until a top surface 28 of the conductive connector 26is exposed. The region where the through via 23 is not formed may not beetched to a greater depth than the region where the through via 23 isformed. As a result, a first sub trench 105 formed where the through via23 is formed and a second sub trench 106 formed where the through via 23is not formed may have different depths. In an exemplary embodiment, thedepth of the second sub trench 106 may be greater than that of the firstsub trench 105. On the other hand, a width w6 of the first sub trench105 may be smaller than the width w1 of the via hole 16. After theetching, the third photoresist pattern 121 may be removed.

Referring to FIG. 20, an insulation layer 35′ may be formed on thesecond surface 12 of the semiconductor substrate 10 having the trenches105 and 106. The insulation layer 35′ may be formed by physical vapordeposition (PVD) or chemical vapor deposition (CVD). The insulationlayer 35′ may be conformally formed along the second surface 12 of thesemiconductor substrate 10. A second photoresist pattern 110 may beformed on the insulation layer 35′. The second photoresist pattern 110may be formed at a location where the insulation layer 35′ is not to beremoved. A predetermined region 35 a of the insulation layer 35′ exposedby the second photoresist pattern 110 may be removed to form aninsulation layer pattern 35. The second photoresist pattern 110 may beformed such that a width w5 of the predetermined region 35 a of theinsulation layer pattern 35 is smaller than the width w1 of the via hole16 or the width w3 of the conductive connector 26.

Referring to FIG. 21, the predetermined region 35 a (FIG. 20) of theinsulation layer 35′ exposed by the second photoresist pattern 110 isetched using the second photoresist pattern 110 as an etch mask. Theetching may include wet etching or dry etching. A width w2 of apredetermined region of the top surface 28 of the through via 23 exposedby the insulation layer pattern 35 may be smaller than the width w1 ofthe via hole 16 or the width 23 of the conductive connector 26. Since aportion of the top surface of the via hole insulating layer 22 is notexposed in the etching of the insulation layer 35′, it is possible toprevent the via hole insulating layer 22 from being damaged at aninterface between the semiconductor substrate 10 and the via holeinsulating layer 22 in the etching of the insulation layer 35′.

A portion of the insulation layer pattern 35 may overlap with apredetermined region of the through via 23, e.g., a predetermined regionof the conductive connector 26. A sidewall 36 of the insulation layerpattern 35 may be spaced apart from an inner wall 17 of the via hole 16and may be positioned on the conductive connector 26.

Referring to FIG. 8, the redistribution layer forming conductive layer40 is formed on the insulation layer pattern 35 in the same manner asshown in FIG. 14, and the insulation layer pattern 35 formed on theinitial second surface 12′ of the semiconductor substrate 10 may beexposed by a planarizing process. For example, the planarizing processmay be a chemical mechanical polishing (CMP) process of removing theredistribution layer forming conductive layer 40. In the planarizingprocess, the insulation layer pattern 35 formed on the initial secondsurface 12′ of the semiconductor substrate 10 may be used as aplanarizing stopper layer.

The embodiments previously described with reference to FIGS. 1 to 9 mayalso be applied to an interposer 4. In this case, the integrated circuit13 illustrated in FIGS. 1 to 9 may not be formed.

An interposer according to an embodiment of the inventive concept and asemiconductor package using the interposer will now be described withreference to FIGS. 22 and 23. FIG. 22 is a cross-sectional viewillustrating an interposer to which the embodiment of the inventiveconcept shown in FIG. 6 is used, and FIG. 23 is a cross-sectional viewillustrating a semiconductor package using the interposer shown in FIG.22. While FIGS. 22 and 23 illustrate the interposer using thesemiconductor device shown in FIG. 6, other semiconductor devices shownin FIGS. 1 to 9 may also be used.

Referring to FIG. 22, the semiconductor substrate 10 of the interposer 4may be a silicon or glass substrate. A second connection terminal 76 maybe formed on a first surface 11 of the semiconductor substrate 10. Thesecond connection terminal 76 is electrically connected to a throughelectrode 20. The second connection terminal 76 may be at least oneselected from the group consisting of a conductive bump, a solder ball,a conductive spacer, a pin grid array (PGA), and combinations thereof.

Referring to FIG. 23, the interposer 4 shown in FIG. 22 may be mountedon a package substrate 200. The package substrate 200 having a circuitpattern 204 formed thereon may be a flexible printed circuit board, arigid printed circuit board, or a combination thereof. The circuitpattern 204 may be connected to a bonding pad 202 or ball pad 206exposed externally.

The interposer 4 may be electrically connected to the bonding pad 202through the second connection terminal 76 connected to a conductiveconnector 26. In addition, the interposer 4 may be connected to anexternal connection terminal 208 through the circuit pattern 204 of thepackage substrate 200.

Another semiconductor device 300 may be stacked on the interposer 4. Thesemiconductor device 300 may be electrically connected to aredistribution layer 45 of the interposer 4 through a third connectionterminal 83. In an exemplary embodiment, the semiconductor device 300may be a semiconductor chip, and the third connection terminal 83 may bea flip-chip bump or a conductive bump. If a plurality of the thirdconnection terminal 83 and a plurality of the through electrode 20 areformed, an interval between the third connection terminals 83 may besmaller than an interval between the through electrodes 20. When it isnot possible to connect the semiconductor device 300 directly with tothe bonding pad 202 of the package substrate 200 due to a small intervalbetween the third connection terminals 83, the interposer 4 includingthe redistribution layer 45 may be disposed between the semiconductordevice 300 and the package substrate 200.

A semiconductor package according to another embodiment of the inventiveconcept will now be described with reference to FIG. 24. FIG. 24 is across-sectional view illustrating a semiconductor package according toanother embodiment of the inventive concept.

The embodiments previously described with reference to FIGS. 1 to 9 maybe applied to a first semiconductor chip 400 including a first throughvia 23 of a semiconductor package. FIG. 24 shows that the semiconductordevice shown in FIG. 6 is used as the first semiconductor chip 400.

Referring to FIG. 24, a second semiconductor chip 500 may be stacked onthe first semiconductor chip 400. The second semiconductor chip 500 maybe a semiconductor chip different from the first semiconductor chip 400.In an exemplary embodiment, the first semiconductor chip 400 may includea logic circuit, and the second semiconductor chip 500 may include amemory circuit. The second semiconductor chip 500 may be ahigh-performance memory chip for assisting the operation of the firstsemiconductor chip 400.

The first semiconductor chip 400 may be mounted on a package substrate200 such that its first surface 11 faces the package substrate 200. Thefirst semiconductor chip 400 may include a first connection terminal 73on its first surface 11. The first connection terminal 73 may beconnected to a through electrode 20. In addition, the first connectionterminal 73 may be connected to an integrated circuit 13. The integratedcircuit 13 may be directly connected to the package substrate 200through the first connection terminal 73. The integrated circuit 13 maybe directly connected to the second semiconductor chip 500 through thethrough electrode 20 and the redistribution layer 45.

The second semiconductor chip 500 may be connected to the firstsemiconductor chip 400 through a third connection terminal 83 formed onone surface thereof. The third connection terminal 83 and the throughelectrode 20 may be connected to each other through the redistributionlayer 45. The second semiconductor chip 500 may be electricallyconnected to the package substrate 200 through the third connectionterminal 83, the redistribution layer 45, the through electrode 20 andthe first connection terminal 73.

In one embodiment, the second semiconductor device 500 may include asecond through via 87, which does not overlap with a first through via23 in plan view or in cross-sectional view.

In another embodiment, one or more additional semiconductor devices (notillustrated) can be stacked over the second semiconductor device 500 andcan be electrically coupled to the second through via 87 and one or moreredistribution layers.

FIGS. 25 and 26 illustrate a fabricating method of a semiconductorpackage, according to an embodiment of the inventive concept.

Referring to FIG. 25, a plurality of semiconductor wafers 100 havingsemiconductor devices obtained by the fabricating methods shown in FIGS.1 to 22 may be provided. The plurality of semiconductor wafers 100 maybe stacked one on another. The stacked plurality of semiconductor wafers100 are cut along scribe line portions of the semiconductor devices,thereby separating the semiconductor wafers 100 into individualsemiconductor packages. The cutting may be performed using a cutter 120or laser.

Alternatively, as shown in FIG. 26, individual semiconductor devices 100a, 100 b, are stacked on the semiconductor wafer 100 to formsemiconductor packages. Alternatively, the semiconductor wafer 100 maybe cut along scribing lane portions to be separated into individualsemiconductor devices 100 a, 100 b, . . . , which are then stacked oneon another, to form semiconductor packages.

FIG. 27 is a schematic view of a memory card 800 in which thesemiconductor device.

Referring to FIG. 27, the memory card 800 may include a controller 820and a memory 830 in a housing 810. The controller 820 and the memory 830may exchange electrical signals. For example, the memory 830 and thecontroller 820 may exchange data in response to the command of thecontroller 820. Accordingly, the memory card 800 may store data in thememory 830 or may output the data stored in the memory 830 to theoutside.

The controller 820 or the memory 830 may include at least one of asemiconductor device or a semiconductor package according to someembodiments of the inventive concept. In an exemplary embodiment, thecontroller 820 may include a system in package, and the memory 830 mayinclude a multi-chip package. Alternatively the controller 820 and/orthe memory 830 may be provided as a stacked package. The memory card 800may be used as data storage media for a variety of portable devices. Forexample, the memory card 800 may be a multimedia card (MMC), or a securedigital card (SD).

FIG. 28 is a schematic view of an electronic system 900 in which thesemiconductor device according to an embodiment of the inventive conceptis used. Referring to FIG. 28, the electronic system 900 may include asemiconductor device or a semiconductor package according to exampleembodiments. The electronic system 900 may include a mobile device or acomputer. For example, the electronic system 900 may include a memorysystem 912, a processor 914, RAM 916, and a user interface 918, whichmay execute data communication using a bus 920. The processor 914 mayexecute the program and control the electronic system 900. The RAM 916may be used as an operation memory of the processor 914. For example,the processor 914 or the RAM 916 may include a semiconductor device or asemiconductor package according to example embodiments. Alternatively,the processor 914 and the RAM 916 may be packaged in a single packagebody. The user interface 918 may be used in inputting/outputting datato/from the electronic system 900. The memory system 912 may store codesfor operating the processor 914, data processed by the processor 914, orexternally input data. The memory system 912 may include a controllerand a memory, and has substantially the same configuration as that ofthe memory card 800 shown in FIG. 25.

The electronic system 900 may be used in electronic controllers for avariety of electronic devices. FIG. 29 is a schematic view of a mobilephone 1000 in which the electronic system (900 of FIG. 28) according toan embodiment of the inventive concept is used. Additionally, theelectronic system (900 of FIG. 28) may be used for a portable notebookcomputer, an mpeg-1 audio layer 3 (MP3) player, a navigator, a solidstate disk (SSD), automobiles or household appliances.

The present disclosure provides a semiconductor device which has aredistribution pattern buried in a semiconductor substrate and canprevent characteristics of the semiconductor device from deteriorating,and can further prevent the semiconductor substrate and a throughsilicon via from being shorted.

Throughout the specification, features shown in one embodiment may beincorporated in other embodiments within the spirit and scope of theinventive concept.

Embodiments of the present application may also be applied to formASICs, PLDs/Gate Arrays, DSPs, Graphics and PC chipsets. Also,embodiments of the present application can be used to form a storagedevice for notebook PCs and sub-notebooks for enterprises, Ultra-MobilePCs (UMPC), and Tablet PCs.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the present invention. Thus, theappearances of the phrases “in one embodiment” or “in an embodiment” invarious places throughout this specification are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

Various operations will be described as multiple discrete stepsperformed in a manner that is most helpful in understanding theinvention. However, the order in which the steps are described does notimply that the operations are order-dependent or that the order thatsteps are performed must be the order in which the steps are presented.

While the present disclosure has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the present disclosure as defined by the following claims. It istherefore desired that the present embodiments be considered in allrespects as illustrative and not restrictive, reference being made tothe appended claims rather than the foregoing description to indicatethe scope of the invention.

What is claimed is:
 1. A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface opposite to the first surface, the second surface defining a redistribution trench, the substrate having a via hole extending therethrough; a through via disposed in the via hole, the through via including a via hole insulating layer and a conductive connector sequentially formed therein; an insulation layer pattern formed on the second surface of the substrate, the insulation layer pattern defining an opening that exposes a region of a top surface of the through via; and a redistribution layer disposed in the redistribution trench and electrically connected to the through via, wherein the insulation layer pattern covers an interface region between the second surface of the substrate and a top surface of the via hole insulating layer.
 2. The device of claim 1, further comprising a barrier layer disposed adjacent the via hole insulating layer within the via hole.
 3. The device of claim 1, wherein the top surface of the via hole insulating layer is substantially coplanar with a bottommost portion of the second surface.
 4. The device of claim 1, wherein a sidewall of the insulation layer pattern is positioned on the top surface of the via hole insulating layer.
 5. A semiconductor package comprising: a package substrate; and a first semiconductor device provided on the package substrate, wherein the first semiconductor device comprises: a semiconductor substrate having a first surface, and a second surface opposite to the first surface, the second surface defining a redistribution trench, the substrate having a via hole extending therethrough; a first through via disposed in the via hole, the first through via including a via hole insulating layer, a barrier layer, and a conductive connector sequentially formed therein; an insulation layer pattern formed on the second surface of the substrate, the insulating layer pattern defining an opening that exposes a region of a top surface of the through via; and a redistribution layer disposed in the redistribution trench and electrically connected to the first through via, wherein the insulation layer pattern covers an interface region between the second surface of the substrate and a top surface of the via hole insulating layer.
 6. The semiconductor package of claim 5, wherein the package substrate further comprises a circuit pattern, and the first through via is electrically connected to the circuit pattern.
 7. The semiconductor package of claim 5, further comprising a second semiconductor device overlying the redistribution layer of the first semiconductor device.
 8. The semiconductor package of claim 7, wherein the second semiconductor device include a second through via, and wherein the second through via does not overlap with the first through via.
 9. The semiconductor package of claim 7, wherein the second semiconductor device includes a connection terminal coupled to the second through via, and wherein the connectional terminal is coupled to the redistribution layer.
 10. The semiconductor package of claim 9, further comprising a protective layer overlying the redistribution layer having an opening part exposing a region of the redistribution layer such that the connection terminal can be mounted there on. 